Has anyone successfully shaved superfluous metal from the cases of some of the powerful but heavy IC's. I look at the ST .51, the entire OS AX series, possibly the old Veco/K&B/Mecoa .61's, the teardrop rear of the Evo .60 case and head, and I can't help think that their cases are needlessly "beefy." Not a machinist, my thoughts include files, rasps, and sanding discs! I know, I know- "Horrors-I can't watch"....but since we're not opperating in screaming-lean R/C mode, I doubt that all the case strength or heat disippation is required for our application.